NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...

Accurate characterisation of high-frequency transistors relies on on-wafer calibration methods that remove systematic errors introduced by probing hardware, cabling and substrate interactions. Such ...

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the ...

TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products. The ...

It took scientists just 0.9 megapascals of pressure to pierce a problem holding back the next wave of display technology. At Tianjin University, researchers have unveiled a groundbreaking method to ...

The semiconductor industry is changing rapidly, with one of the biggest developments being the move from traditional pogo-based die probing to photonic beam probing for Very-Large-Scale Integration ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...

Probing solution is industry first to operate at bandwidths greater than 50 GHz with high-impedance probe head High-impedance, turnkey solution delivers bandwidths up to 52 GHz Brickwall and 40 GHz ...

Based on FormFactor's scalable MicroSpring interconnect technology, the PH150 probe card enables the testing of 300-mm DRAM wafers in just six touchdowns. The ability to test a wafer in fewer ...