Add Yahoo as a preferred source to see more of our stories on Google. Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

Intel has confirmed that it’s working on a discrete graphics solution for “client PCs,” which will arrive in 2020. That, however, is far from all Intel is working on. The company laid out its ...

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...

"Hot Chips" sounds like a nice side dish, but is in fact a technological symposium held yearly in Silicon Valley. It's a place for processor vendors to talk about their latest innovations, and while ...

Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to ...

Intel will invest $3.5 billion in its Rio Rancho fab to support Foveros, its 3D manufacturing and packaging technology. The site in New Mexico is currently used to manufacture Optane memory and ...

Intel Foveros isn't the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip components, and thus improve the speed of devices without having to ...